MT57W1MH18C Micron Semiconductor Products, Inc., MT57W1MH18C Datasheet - Page 23

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MT57W1MH18C

Manufacturer Part Number
MT57W1MH18C
Description
18Mb Ddrii SRAM, 1.8V Vdd, Hstl, 2-Word Burst,
Manufacturer
Micron Semiconductor Products, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT57W1MH18CF-4
Manufacturer:
MICRON/美光
Quantity:
20 000
NOTE:
Table 14: TAP AC Electrical Characteristics
Notes 1, 2; 0°C £ T
NOTE:
18Mb: 2 Meg x 8, 1 Meg x 18, 512K x 36, 1.8V V
MT57W1MH18C_H.fm – Rev. H, Pub. 3/03
1.
2. Test conditions are specified using the load in Figure 10.
DESCRIPTION
Clock
Clock cycle time
Clock frequency
Clock HIGH time
Clock LOW time
Output Times
TCK LOW to TDO unknown
TCK LOW to TDO valid
TDI valid to TCK HIGH
TCK HIGH to TDI invalid
Setup Times
TMS setup
Capture setup
Hold Times
TMS hold
Capture hold
Timing for SRAM inputs and outputs is congruent with TDI and TDO, respectively, as shown in Figure 9.
t
CS and
t
CH refer to the setup and hold time requirements of latching data from the boundary scan register.
A
£ +70°C; V
Test Mode Select
Test Data-Out
DD
Test Data-In
, HSTL, DDR SIO SRAM
Test Clock
DD
(TDO)
(TMS)
(TCK)
= 1.8V ±0.1V
(TDI)
1
Figure 9: TAP Timing
t MVTH
t DVTH
2
t THTL
t THMX
t THDX
23
t
TLTH
2 MEG
3
1.8V V
t THTH
SYMBOL
t
t
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
t
t
t
t
t
t
MVTH
THMX
DVTH
THDX
THTH
TLOX
TLOV
THTL
TLTH
t
DON’T CARE
f
t
CH
CS
TF
X
4
8, 1 MEG
DD
t TLOX
, HSTL, DDR SIO SRAM
t TLOV
5
UNDEFINED
MIN
X
100
40
40
10
10
10
10
10
10
0
18, 512K
6
MAX
10
20
©2003 Micron Technology, Inc.
X
UNITS
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
36

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