LAN89218AQ Standard Microsystems (SMSC), LAN89218AQ Datasheet - Page 152

• Manufacturer Part Number: LAN89218AQ
• Manufacturer: Standard Microsystems (SMSC)

Specifications of LAN89218AQ

• Lead Free Status / RoHS Status: Compliant

Chapter 8 Package Outline
Revision 1.3 (02-23-10)
8.1
ccc
A1
A2
E1
R1
R2
L1
D1
W
D
H
A
E
L
e
q
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
100-TQFP Package
15.80
13.80
15.80
13.80
0.05
1.35
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
Maximum mold protrusion is 0.25 mm.
o
0.50 Basic
NOMINAL
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
Figure 8.1 100-Pin TQFP Package Definition
Table 8.1 100-Pin TQFP Package Parameters
High Performance Single-Chip 10/100 Ethernet Controller for Automotive Applications
16.20
14.20
16.20
14.20
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
o
152
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Radius
Lead Foot Length
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
SMSC LAN89218
Datasheet