MCF5272VM66 Freescale Semiconductor, MCF5272VM66 Datasheet - Page 204

• Manufacturer Part Number: MCF5272VM66
• Description: IC MPU 66MHZ COLDFIRE 196-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5272VM66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• Ram Size: 1K x 32
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 196-MAPBGA
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Cpu Speed: 66MHz
• Embedded Interface Type: UART, QSPI, USB, TDM
• Digital Ic Case Style: BGA
• No. Of Pins: 196
• Supply Voltage Range: 3V To 3.6V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

SDRAM Controller
Selecting a system clock frequency low enough that the SDCLK-to-CLK delay is long compared to the
SDRAM read access time reduces effective CAS latency by 1 cycle.
9.10
Setting CSBRn[EBI] to 0b01 enables chip select CS7 for use with one physical bank of SDRAM. In this
case, CS7 becomes SDCS. The SDRAM memory array may have a 32- or 16-bit data bus width; an 8-bit
width is not supported. An array may consist of SDRAM devices with 8, 16, or 32 bits data bus width.
Each SDRAM device can have from 16–256 Mbits.
The interface to the SDRAM devices is glueless. The following control signals are dedicated to SDRAM:
SDCS, SDWE, A10_PRECHG, SDCLK, SDCLKE, RAS0, CAS0, and SDBA[1:0].
If SDRAM EBI mode is used, CSOR7[WAITST] should be programmed for 0x1F to ensure that the
internal bus cycle termination signal is sourced from the SDRAM controller and not the chip select
module.
9-14
Internal CLK
SDRAM Interface
SDCLK
Data
When reduced effective CAS latency is used, the SDRAM is still
programmed with true CAS latency. The SDRAM controller state machine
must be reprogrammed for the reduced CAS latency. SDRAM initialization
software programs the CAS latency of 2 and transfers it into the SDRAM
mode register. After SDRAM initialization is confirmed, initialization
software should change SDTR[CLT] to CAS latency 1 but should not
reinitialize the SDRAM. The SDRAM controller state machine now runs
with CAS latency 1 and SDRAMs run with CAS latency 2, which increases
bandwidth on the SDRAM bank and improves performance.
MCF5272 ColdFire
Figure 9-8. Timing Refinement with Effective CAS Latency
T
SDCLK_to_CLK
Shifted delay of SDCLK
®
Integrated Microprocessor User’s Manual, Rev. 3
- T
CASL = 1
acc
NOTE
> 0 => effective CAS latency reduced by 1
SDRAM read access time
Delay SDCLK to CLK
Freescale Semiconductor