UPD78F0552MA-FAA-AX Renesas Electronics America, UPD78F0552MA-FAA-AX Datasheet - Page 718

• Manufacturer Part Number: UPD78F0552MA-FAA-AX
• Description: MCU 8BIT 16-SSOP
• Manufacturer: Renesas Electronics America
• Series: 78K0/Kx2-Lr

Specifications of UPD78F0552MA-FAA-AX

• Core Processor: 78K/0
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: I²C, LIN, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 9
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

78K0/Kx2-L
25.4.7 On-board writing when connecting crystal/ceramic resonator
provided on the target system.
programming mode on the board.
same status as immediately after reset. Therefore, if the external device does not recognize the state immediately after
reset, the pins must be processed as described below.
will collide if an external device is connected. To prevent the conflict of signals, isolate the connection with the external
device.
thus communication may be disabled depending on the capacitor capacitance. Make sure to isolate the connection with
the capacitor during flash programming.
been made to execute on-board flash programming with the resonator mounted on the device because it is difficult to
isolate the resonator, be sure to thoroughly evaluate the flash memory programming with the resonator mounted on the
device before executing the processing described next.
R01UH0028EJ0400 Rev.4.00
Sep 27, 2010
To write the flash memory on-board, connectors that connect the dedicated flash memory programmer must be
When the flash memory programming mode is set, all the pins not used for programming the flash memory are in the
The state of the pins in the self programming mode is the same as that in the HALT mode.
When using the X1 (TOOLC0) and X2 (TOOLD0) pins as the serial interface for flash memory programming, signals
Similarly, when a capacitor is connected to the X1 and X2 pins, the waveform during communication is changed, and
In cases when a crystal or ceramic resonator has been selected to generate the system clock, and the decision has
• Mount the minimum-possible test pads between the device and the resonator, and connect the programmer via the
test pad. Keep the wiring as short as possible (refer to Figure 25-5 and Table 25-4).
High-speed internal oscillation clock
External clock
Crystal/ceramic oscillation
clock
Table 25-4. Clock to Be Used and Mounting of Test Pads
First provide a function that selects the normal operation mode or flash memory
Figure 25-5. Example of Mounting Test Pads
Clock to Be Used
Before resonator is mounted
After resonator is mounted
V
SS
(TOOLC0)
X1
Test pad
(TOOLD0)
X2
Not required
Required
Mounting of Test Pads
CHAPTER 25 FLASH MEMORY
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