D17760BP200AD Renesas Electronics America, D17760BP200AD Datasheet - Page 83
D17760BP200AD
Manufacturer Part Number
D17760BP200AD
Description
IC SUPERH MPU ROMLESS 256-BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet
1.D6417760BP200ADV.pdf
(1418 pages)
Specifications of D17760BP200AD
Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
Audio Codec, CAN, EBI/EMI, FIFO, I²C, MFI, MMC, SCI, Serial Sound, SIM, SPI, USB
Peripherals
DMA, LCD, POR, WDT
Number Of I /o
69
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D17760BP200AD
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
D17760BP200ADV
Manufacturer:
Renesas Electronics America
Quantity:
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Section 31 User Break Controller (UBC)
Table 31.1
Table 31.1
Section 33 Electrical Characteristics
Table 33.1
Table 33.2
Table 33.3
Table 33.4
Table 33.5
Table 33.6
Table 33.7
Table 33.8
Table 33.9
Table 33.10 TMU Module Signal Timing................................................................................ 1273
Table 33.11 SCIF Module Signal Timing ................................................................................ 1274
Table 33.12 H-UDI Module Signal Timing ............................................................................. 1275
Table 33.13 CMT Module Signal Timing ................................................................................ 1276
Table 33.14 HCAN2 Module Signal Timing ........................................................................... 1277
Table 33.15 GPIO Signal Timing............................................................................................. 1278
Table 33.16 Truth Table of I
Table 33.17 I
Table 33.18 I
Table 33.19 I
Table 33.20 HSPI Module Signal Timing ................................................................................ 1282
Table 33.21 USB DC characteristics........................................................................................ 1284
Table 33.22 USB AC characteristics........................................................................................ 1285
Table 33.23 AC Characteristics of 68 Series Bus..................................................................... 1287
Table 33.24 AC Characteristics of 80 Series Bus..................................................................... 1288
Table 33.25 SIM Module Signal Timing.................................................................................. 1290
Table 33.26 MMCIF Module Signal Timing ........................................................................... 1290
Table 33.27 LCDC Module Signal Timing .............................................................................. 1292
Table 33.28 HAC Interface Module Signal Timing ................................................................. 1293
Table 33.29 SSI Interface Module Signal Timing.................................................................... 1294
Table 33.30 A/D Converter Characteristics ............................................................................. 1296
Appendix
Table B.1
Table B.2
Table B.3
Table B.4
Register Configuration (1).................................................................................... 1121
Register Configuration (2).................................................................................... 1122
Absolute Maximum Ratings................................................................................. 1225
DC Characteristics (T
Permissible Output Currents................................................................................. 1228
Clock Timing........................................................................................................ 1228
Clock and Control Signal Timing......................................................................... 1229
Control Signal Timing.......................................................................................... 1236
Bus Timing........................................................................................................... 1239
INTC Module Signal Timing ............................................................................... 1272
DMAC Module Signal Timing............................................................................. 1272
Clock Operating Modes (SH7760)....................................................................... 1301
Area 0 Memory Map and Bus Width ................................................................... 1301
Endian .................................................................................................................. 1302
MFI Mode/LCD Mode ......................................................................................... 1302
2
2
2
C DC Characteristics.......................................................................................... 1279
C Bus Interface Module Signal Timing ............................................................. 1280
C Schmitt characteristics.................................................................................... 1280
2
C I/O Buffer ............................................................................... 1279
a
= −20 to 75°C/−40 to 85°C) ............................................ 1226
Rev. 2.00 Feb. 12, 2010 Page lxxxi of lxxxii
REJ09B0554-0200
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