DF3048BVX25V Renesas Electronics America, DF3048BVX25V Datasheet - Page 896
DF3048BVX25V
Manufacturer Part Number
DF3048BVX25V
Description
MCU 3/5V 128K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3048BVX25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3048BVX25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Timing of Transition to Hardware Standby Mode
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents
Timing of Recovery from Hardware Standby Mode
Drive the RES signal low approximately 100 ns before STBY goes high.
Rev. 3.00 Sep 27, 2006 page 868 of 872
REJ09B0325-0300
STBY
RES
STBY
RES
Appendix E Timing of Transition to and Recovery from
system clock cycles before the STBY signal goes low, as shown below. RES must remain low
until STBY goes low (minimum delay from STBY low to RES high: 0 ns).
do not need to be retained, RES does not have to be driven low as in (1).
Hardware Standby Mode
t
1
t
10t
100 ns
cyc
t
2
0 ns
t
OSC
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