MCHC705JJ7CPE Freescale Semiconductor, MCHC705JJ7CPE Datasheet - Page 157

• Manufacturer Part Number: MCHC705JJ7CPE
• Description: IC MCU 8BIT 224 BYTES RAM 20PDIP
• Manufacturer: Freescale Semiconductor
• Series: HC05r

Specifications of MCHC705JJ7CPE

• Core Processor: HC05
• Core Size: 8-Bit
• Speed: 2.1MHz
• Connectivity: SIO
• Peripherals: POR, Temp Sensor, WDT
• Number Of I /o: 14
• Program Memory Size: 6KB (6K x 8)
• Program Memory Type: OTP
• Ram Size: 224 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Processor Series: HC705JJ
• Core: HC05
• Data Bus Width: 8 bit
• Data Ram Size: 224 B
• Interface Type: SIOP
• Maximum Clock Frequency: 2.1 MHz
• Number Of Programmable I/os: 14
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 4 Channel
• Package: 20PDIP
• Family Name: HC05
• Maximum Speed: 2.1 MHz
• Operating Supply Voltage: 3.3|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Chapter 16
Mechanical Specifications
16.1 Introduction
The MC68HC705JJ7 is available in:
The MC68HC705JP7 is available in:
The following figures show the latest package drawings at the time of this publication. To make sure that
you have the latest package specifications, contact your local Freescale Sales Office.
16.2 20-Pin Plastic Dual In-Line Package (Case 738)
Freescale Semiconductor
•
•
•
•
•
•
SEATING
PLANE
-T-
20-pin plastic dual in-line package (PDIP)
20-pin small outline integrated circuit (SOIC) package
20-pin windowed ceramic package
28-pin plastic dual in-line package (PDIP)
28-pin small outline integrated circuit (SOIC) package
28-pin windowed ceramic package
20
1
G
E
MC68HC705JJ7 • MC68HC705JP7 Advance Information Data Sheet, Rev. 4.1
F
-A-
D
20 PL
11
10
0.25 (0.010)
N
B
K
M
C
T A
M
J
L
20 PL
0.25 (0.010)
M
M
T B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
A
B
C
D
G
K
M
N
E
F
J
L
1.010
0.240
0.150
0.015
0.050
0.008
0.110
0.020
MIN
0.050 BSC
0.100 BSC
0.300 BSC
0°
INCHES
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15°
MILLIMETERS
25.66
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
0°
1.27 BSC
2.54 BSC
7.62 BSC
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15°
157