PIC18C658-I/L Microchip Technology, PIC18C658-I/L Datasheet - Page 348

IC PIC MCU OTP 16KX16 68PLCC

PIC18C658-I/L

Manufacturer Part Number
PIC18C658-I/L
Description
IC PIC MCU OTP 16KX16 68PLCC
Manufacturer
Microchip Technology
Series
PIC® 18Cr

Specifications of PIC18C658-I/L

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Number Of I /o
52
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
68-PLCC
Controller Family/series
PIC18
No. Of I/o's
52
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
3-Wire, I2C, SPI, USART, CAN
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
52
Number Of Timers
4 bit
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
ICE2000, DM163007, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164308 - MODULE SKT FOR PM3 68PLCCDVA18PQ640 - DEVICE ADAPT PIC18C658 64-TQFPAC174007 - MODULE SKT PROMATEII 68PLCC
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
PIC18C658IL
Q1162292

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18C658-I/L
Manufacturer:
Microchip
Quantity:
385
Part Number:
PIC18C658-I/L
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18C658-I/L
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18CXX8
84-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30475A-page 348
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-093
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
n
E2
Dimension Limits
E
E1
1
2
CH1 x 45
Units
CH2
CH1
E2
D2
A2
A1
A3
E1
D1
B1
n1
D
n
p
A
E
c
B
Advanced Information
D1
MIN
D
A2
.165
.145
.020
.024
.040
.000
.985
.985
.950
.950
.890
.890
.008
.026
.013
0
0
32
INCHES*
NOM
A
.045
.005
.050
.173
.153
.028
.029
.990
.990
.954
.954
.920
.920
.029
.020
.011
68
17
5
5
A3
MAX
.180
.160
.035
.034
.050
.010
.995
.995
.958
.958
.930
.930
.013
.032
.021
10
10
B1
B
MIN
25.02
25.02
24.13
24.13
22.61
22.61
4.19
3.68
1.02
0.00
0.20
0.66
0.33
0.51
0.61
D2
0
0
MILLIMETERS
p
NOM
2000 Microchip Technology Inc.
25.15
25.15
24.23
24.23
23.37
23.37
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
68
17
5
5
MAX
A1
25.27
25.27
24.33
24.33
23.62
23.62
4.06
4.57
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10

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