HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 321

MPU 1.5/3.3V 0K I-TEMP PB-FREE 2

HD6417750RF200DV

Manufacturer Part Number
HD6417750RF200DV
Description
MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750RF200DV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.35 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750RF200DV
Manufacturer:
FREESCALE
Quantity:
450
19. LDC.L to SR: 4 issue cycles
20. STC from DBR/GBR/Rp_BANK/SR/SSR/SPC/VBR: 2 issue cycles
21. STC.L from SGR: 3 issue cycles
22. STC.L from DBR/GBR/Rp_BANK/SR/SSR/SPC/VBR: 2 issue cycles
23. STC.L from SGR: 3 issue cycles
24. LDS to PR, JSR, BSRF: 2 issue cycles
25. LDS.L to PR: 2 issue cycles
26. STS from PR: 2 issue cycles
27. STS.L from PR: 2 issue cycles
28. CLRMAC, LDS to MACH/L: 1 issue cycle
29. LDS.L to MACH/L: 1 issue cycle
30. STS from MACH/L: 1 issue cycle
Figure 8.2 Instruction Execution Patterns (cont)
I
I
I
I
I
I
I
I
I
I
I
I
D
D
D
D
D
D
D
D
D
D
D
D
EX
EX
EX
SX
SX
EX
EX
EX
D
SX
SX
SX
SX
D
D
D
D
D
D
D
D
MA
NA
MA
NA
SX
NA
SX
SX
SX
SX
SX
NA
SX
NA
SX
NA
NA
MA
NA
NA
SX
D
D
D
F1
F1
SX
SX
SX
NA
NA
SX
NA
SX
NA
MA
F1
Rev.7.00 Oct. 10, 2008 Page 235 of 1074
MA
F1
S
S
S
D
S
S
S
S
S
S
S
S
S
SX
NA
MA
F2
F2
S
S
S
S
S
S
FS
FS
S
S
Section 8 Pipelining
REJ09B0366-0700

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