HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 1054

MPU 1.5/3.3V 0K I-TEMP PB-FREE 2

HD6417750RF200DV

Manufacturer Part Number
HD6417750RF200DV
Description
MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750RF200DV

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.35 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
208-QFP Exposed Pad, 208-eQFP, 208-HQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750RF200DV
Manufacturer:
FREESCALE
Quantity:
450
Section 22 Electrical Characteristics
Rev.7.00 Oct. 10, 2008 Page 968 of 1074
REJ09B0366-0700
Figure 22.27 Synchronous DRAM Normal Read Bus Cycle: READ Command, Burst
D63–D0
(read)
D63–D0
(write)
DACKn
(SA: IO ← memory)
Legend:
IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
CKIO
BANK
Precharge-sel
Address
CSn
RD/WR
RAS
CASS
DQMn
BS
CKE
t
t
t
t
t
t
t
t
Tc1
RWD
RASD
AD
CSD
CASD2
DQMD
WDD
DACD
c0
Row
((RASD = 1, CAS Latency = 3)
H/L
t
Tc2
CASD2
Tc3
Tc4/Td1
t
RDS
t
t
BSD
DACD
d0
Td2
t
BSD
t
RDH
d1
Td3
t
DQMD
d2
Td4
d3
t
t
t
t
t
t
AD
CSD
RWD
RASD
DACD
WDD

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