ATTINY2313A-PU Atmel, ATTINY2313A-PU Datasheet - Page 184

IC MCU AVR 2K FLASH 20MHZ 20DIP

ATTINY2313A-PU

Manufacturer Part Number
ATTINY2313A-PU
Description
IC MCU AVR 2K FLASH 20MHZ 20DIP
Manufacturer
Atmel
Series
AVR® ATtinyr
Datasheets

Specifications of ATTINY2313A-PU

Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
18
Program Memory Size
2KB (1K x 16)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Processor Series
ATTINY2x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
18
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
EWAVR, EWAVR-BL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT
Minimum Operating Temperature
- 40 C
Controller Family/series
ATtiny
No. Of I/o's
18
Eeprom Memory Size
128Byte
Ram Memory Size
128Byte
Cpu Speed
20MHz
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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20.6.2
20.6.3
20.6.4
184
ATtiny2313A/4313
Considerations for Efficient Programming
Chip Erase
Programming the Flash
If the rise time of the V
tive algorithm can be used.
The loaded command and address are retained in the device during programming. For efficient
programming, the following should be considered.
The Chip Erase will erase the Flash and EEPROM
are not reset until the program memory has been completely erased. The Fuse bits are not
changed. A Chip Erase must be performed before the Flash and/or EEPROM are
reprogrammed.
Note:
Load Command “Chip Erase”
The Flash is organized in pages, see
the program data is latched into a page buffer. This allows one page of program data to be pro-
4. Wait 20 - 60 µs, and apply 11.5 - 12.5V to RESET.
5. Keep the Prog_enable pins unchanged for at least 10µs after the High-voltage has
6. Wait at least 300 µs before giving any parallel programming commands.
7. Exit Programming mode by power the device down or by bringing RESET pin to 0V.
1. Set Prog_enable pins listed in
2. Apply 4.5 - 5.5V between V
3. Monitor V
4. Keep the Prog_enable pins unchanged for at least 10µs after the High-voltage has
5. Wait until V
6. Exit Programming mode by power the device down or by bringing RESET pin to 0V.
• The command needs only be loaded once when writing or reading multiple memory
• Skip writing the data value 0xFF, that is the contents of the entire EEPROM (unless the
• Address high byte needs only be loaded before programming or reading a new 256 word
1. Set XA1, XA0 to “10”. This enables command loading.
2. Set BS1 to “0”.
3. Set DATA to “1000 0000”. This is the command for Chip Erase.
4. Give XTAL1 a positive pulse. This loads the command.
5. Give WR a negative pulse. This starts the Chip Erase. RDY/BSY goes low.
6. Wait until RDY/BSY goes high before loading a new command.
locations.
EESAVE Fuse is programmed) and Flash after a Chip Erase.
window in Flash or 256 byte EEPROM. This consideration also applies to Signature bytes
reading.
been applied to ensure the Prog_enable Signature has been latched.
and V
been applied to ensure the Prog_enable Signature has been latched.
commands.
The EEPRPOM memory is preserved during Chip Erase if the EESAVE Fuse is programmed.
CC
to 0V.
CC
CC
, and as soon as V
actually reaches 4.5 -5.5V before giving any parallel programming
CC
is unable to fulfill the requirements listed above, the following alterna-
CC
and GND.
Table 20-10 on page 183
CC
“Page Size” on page
reaches 0.9 - 1.1V, apply 11.5 - 12.5V to RESET.
(Note:)
memories plus Lock bits. The Lock bits
181. When programming the Flash,
to “0000”, RESET pin to 0V
8246A–AVR–11/09

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