MC56F8367EVME Freescale Semiconductor, MC56F8367EVME Datasheet - Page 172
![EVAL BOARD FOR MC56F83X](/photos/9/23/92375/mc56f8367evme_sml.jpg)
MC56F8367EVME
Manufacturer Part Number
MC56F8367EVME
Description
EVAL BOARD FOR MC56F83X
Manufacturer
Freescale Semiconductor
Type
DSPr
Specifications of MC56F8367EVME
Contents
Module and Misc Hardware
Processor To Be Evaluated
MC56F8145-67 and MC56F8345-67
Data Bus Width
16 bit
Interface Type
RS-232
Silicon Manufacturer
Freescale
Core Architecture
56800/E
Core Sub-architecture
56800/E
Silicon Core Number
MC56F
Silicon Family Name
MC56F83xx
Rohs Compliant
Yes
For Use With/related Products
MC56F83x5, MC56F83x6, MC56F83x7
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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172
13X
160X
e
X
3
S
Y
E
b
0.30
0.10 Z
14 13 12 11 10
Z
X
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
Y
0.20
Figure 11-3 160 MAPBGA Mechanical Information
VIEW M-M
9
D
6
13X
S
5
e
4
56F8367 Technical Data, Rev. 8
3
2
1
CASE 1268-01
G
H
K
M
ISSUE O
A
B
C
D
E
F
L
N
P
J
METALIZED MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
K
M
A
A2
A1
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
Z
DETAIL K
DIM MIN
A1
A2
A
b
D
E
S
e
MILLIMETERS
°
4
1.32
0.27
0.35
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
1.18 REF
Freescale Semiconductor
MAX
1.75
0.47
0.65
0.15 Z
160X
5
0.30 Z
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