MC56F8367EVME Freescale Semiconductor, MC56F8367EVME Datasheet - Page 172

• Manufacturer Part Number: MC56F8367EVME
• Description: EVAL BOARD FOR MC56F83X
• Manufacturer: Freescale Semiconductor
• Type: DSPr

Specifications of MC56F8367EVME

• Contents: Module and Misc Hardware
• Processor To Be Evaluated: MC56F8145-67 and MC56F8345-67
• Data Bus Width: 16 bit
• Interface Type: RS-232
• Silicon Manufacturer: Freescale
• Core Architecture: 56800/E
• Core Sub-architecture: 56800/E
• Silicon Core Number: MC56F
• Silicon Family Name: MC56F83xx
• Rohs Compliant: Yes
• For Use With/related Products: MC56F83x5, MC56F83x6, MC56F83x7
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

172
13X
160X
e
X
3
S
Y
E
b
0.30
0.10 Z
14 13 12 11 10
Z
X
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
Y
0.20
Figure 11-3 160 MAPBGA Mechanical Information
VIEW M-M
9
D
6
13X
S
5
e
4
56F8367 Technical Data, Rev. 8
3
2
1
CASE 1268-01
G
H
K
M
ISSUE O
A
B
C
D
E
F
L
N
P
J
METALIZED MARK FOR
PIN 1 IDENTIFICATION
IN THIS AREA
K
M
A
A2
A1
ROTATED 90 CLOCKWISE
NOTES:
1.
2.
3.
4.
5.
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
Z
DETAIL K
DIM MIN
A1
A2
A
b
D
E
S
e
MILLIMETERS
°
4
1.32
0.27
0.35
15.00 BSC
15.00 BSC
1.00 BSC
0.50 BSC
1.18 REF
Freescale Semiconductor
MAX
1.75
0.47
0.65
0.15 Z
160X
5
0.30 Z
Preliminary