MC56F8367EVME Freescale Semiconductor, MC56F8367EVME Datasheet - Page 166

• Manufacturer Part Number: MC56F8367EVME
• Description: EVAL BOARD FOR MC56F83X
• Manufacturer: Freescale Semiconductor
• Type: DSPr

Specifications of MC56F8367EVME

• Contents: Module and Misc Hardware
• Processor To Be Evaluated: MC56F8145-67 and MC56F8345-67
• Data Bus Width: 16 bit
• Interface Type: RS-232
• Silicon Manufacturer: Freescale
• Core Architecture: 56800/E
• Core Sub-architecture: 56800/E
• Silicon Core Number: MC56F
• Silicon Family Name: MC56F83xx
• Rohs Compliant: Yes
• For Use With/related Products: MC56F83x5, MC56F83x6, MC56F83x7
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Part 11 Packaging
Note: The 160 Map Ball Grid Array is not available in the 56F8167 device.
11.1 56F8367 Package and Pin-Out Information
This section contains package and pin-out information for the 56F8367. This device comes in a 160-pin
Low-profile Quad Flat Pack (LQFP) and 160 Map Ball Grid Array.
lay-out for the 160-pin LQFP, and
mechanical parameters for the LQFP package and
pin-out for the 160-pin LQFP and
166
* When the on-chip regulator is disabled, these four pins become 2.5V V
PHASEA1
PHASEB1
GPIOB0
GPIOB1
GPIOB2
GPIOB3
INDEX1
HOME1
GPIOB4
PWMB0
PWMB1
PWMB2
V
V
V
V
CLKO
RXD0
DD_IO
TXD0
DD_IO
DD_IO
V
CAP
D10
A10
A11
A12
A13
A14
A15
V
PP
A1
A2
A3
A4
A5
A6
A7
A8
D7
D8
D9
A9
SS
2
4
Pin 1
41
Figure 11-1 Top View, 56F8367 160-Pin LQFP Package
Orientation Mark
Table 11-2
Figure 11-2
56F8367 Technical Data, Rev. 8
lists the pin-out for the 160 MAPBGA.
DD_CORE
for the160 Map Ball Grid Array.
Figure 11-3
.
for the MAPBGA,
Figure 11-1
81
121
Figure 11-5
Freescale Semiconductor
Table 11-1
shows the package
ANB1
RSTO
FAULTA3
D3
FAULTA2
FAULTA1
D2
FAULTA0
PWMA5
ANB4
ANB3
ANB2
ANB0
V
V
V
V
V
V
V
TEMP_SENSE
ANA7
ANA6
ANA5
ANA4
ANA3
ANA2
ANA1
ANA0
CLKMODE
RESET
V
V
EXTAL
XTAL
VDDA_OSC_PLL
OCR_DIS
D6
D5
D4
SSA_ADC
DDA_ADC
DD_IO
REFH
REFP
REFMID
REFN
REFLO
CAP
3
shows the
Preliminary
lists the