UPD78F0500AMC-CAB-AX Renesas Electronics America, UPD78F0500AMC-CAB-AX Datasheet - Page 912

• Manufacturer Part Number: UPD78F0500AMC-CAB-AX
• Description: MCU 8BIT 30SSOP
• Manufacturer: Renesas Electronics America
• Series: 78K0/Kx2r

Specifications of UPD78F0500AMC-CAB-AX

• Core Processor: 78K/0
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, I²C, LIN, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

78K0/Kx2
sales representative.
Note
Caution The
R01UH0008EJ0401 Rev.4.01
Jul 15, 2010
Infrared reflow
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an Renesas Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www2.renesas.com/pkg/en/mount/index.html)
(1) 36-pin plastic FLGA (4x4)
Table 35-1. Soldering Conditions of Conventional-specification Products (
64-pin plastic FLGA (5x5)
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
μ
μ
PD78F050xFC-AA3-A (x = 0 to 3), 78F0503DFC-AA3-A
PD78F053xFC-AA1-A (x = 1 to 7), 78F0537DFC-AA1-A
Do not use the on-chip debug function in products designated for mass production, because the
guaranteed number of rewritable times of the flash memory may be exceeded when this function is
used, and product reliability therefore cannot be guaranteed. Renesas Electronics is not liable for
problems occurring when the on-chip debug function is used.
μ
PD78F05xxD has an on-chip debug function, which is provided for development and evaluation.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
CHAPTER 35 RECOMMENDED SOLDERING CONDITIONS
CHAPTER 32 ELECTRICAL SPECIFICATIONS (A2) GRADE PRODUCTS
Soldering Conditions
Note
(after that, prebake at 125°C for
μ
PD78F05xx and 78F05xxD) (1/3)
IR60-207-3
Condition Symbol
Recommended
912