DF61657CN35FTV Renesas Electronics America, DF61657CN35FTV Datasheet - Page 758

IC H8SX/1657 MCU FLASH 120TQFP

DF61657CN35FTV

Manufacturer Part Number
DF61657CN35FTV
Description
IC H8SX/1657 MCU FLASH 120TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8SX/1600r
Datasheet

Specifications of DF61657CN35FTV

Core Processor
H8SX
Core Size
32-Bit
Speed
35MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
82
Program Memory Size
768KB (768K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
120-TQFP, 120-VQFP
For Use With
3DK1657 - DEV EVAL KIT FOR H8SX/1657
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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DF61657CN35FTV
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Part Number:
DF61657CN35FTV
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Section 18 Flash Memory (0.18-µm F-ZTAT Version)
• Erasure
Rev. 2.00 Jun. 28, 2007 Page 732 of 864
REJ09B0341-0200
Erasure is executed by the erasure selection and block erasure commands.
Firstly, erasure is selected by the erasure selection command and the boot program then erases
the specified block. The command should be repeatedly executed if two or more blocks are to
be erased. Sending a block erasure command from the host with the block number H'FF will
stop the erasure operating. On completion of erasing, the boot program will wait for selection
of programming or erasing.
The sequence for the erasure selection and block erasure commands is shown in figure 18.28.
Repeat
Host
Figure 18.28 Erasure Sequence
Preparation for erasure (H'48)
Erasure (Erasure block number)
Erasure (H'FF)
ACK
ACK
ACK
Transfer of erasure
Boot program
Erasure
program

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