DF61657CN35FTV Renesas Electronics America, DF61657CN35FTV Datasheet - Page 740

• Manufacturer Part Number: DF61657CN35FTV
• Description: IC H8SX/1657 MCU FLASH 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of DF61657CN35FTV

• Core Processor: H8SX
• Core Size: 32-Bit
• Speed: 35MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 82
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• For Use With: 3DK1657 - DEV EVAL KIT FOR H8SX/1657
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 18 Flash Memory (0.18-µm F-ZTAT Version)
3. Programming/erasing state
These boot program states are shown in figure 18.23.
Rev. 2.00 Jun. 28, 2007 Page 714 of 864
REJ09B0341-0200
Programming and erasure by the boot program take place in this state. The boot program is
made to transfer the programming/erasing programs to the on-chip RAM by commands from
the host. Sum checks and blank checks are executed by sending these commands from the
host.
Programming/erasing
Transition to
programming/erasing
Operations for erasing
user MATs and user
wait
boot MATs
Programming
Operations for
programming
Bit-rate-adjustment
Inquiry/response
Figure 18.23 Boot Program States
state
wait
Reset
Erasing
Inquiry
inquiry and selection
Operations for
Operations for
erasing
Checking
Response
Operations for
Operations for
response
checking