DF2218BR24V Renesas Electronics America, DF2218BR24V Datasheet - Page 65

• Manufacturer Part Number: DF2218BR24V
• Description: IC H8S/2218 MCU FLASH 112-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2218BR24V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-LFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

PF3/LWR/ADTRG/IRQ3
Figure 1.7 Pin Arrangements of HD6432217 (TFP-100G, TFP-100GV)
PF0/BREQ/IRQ2
Notes:
PA3/A19/SCK2
PA2/A18/RxD2
PA1/A17/TxD2
PF1/BACK
PF2/WAIT
PF4/HWR
PD4/D12
PD5/D13
PD6/D14
PD7/D15
PF5/RD
PF6/AS
FWE*
NC (no connection): These pins should not be connected; they should be left open.
1. The FWE pin is provided only in the flash memory version. It should be fixed low.
2. Neither boundary scan nor H-UDI function is available and the pins function as NC.
PF7/φ
NC*
NC*
NC*
NC*
NC*
NC*
VCC
VSS
NMI
1
2
2
2
2
2
2
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
TFP-100GV
(Top View)
TFP-100G
Rev.7.00 Dec. 24, 2008 Page 9 of 698
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
REJ09B0074-0700
PB5/A13
PB4/A12
PLLVCC
UBPM
PLLVSS
P40/AN0
P41/AN1
P42/AN2
P43/AN3
Vref
PB3/A11
PB2/A10
PB1/A9
PB0/A8
P96/AN14
P97/AN15
DrVSS
USD-
USD+
DrVCC
P36(PUPD+)
VBUS
PG4/CS0
PG3/CS1
PG2/CS2