DF2218BR24V Renesas Electronics America, DF2218BR24V Datasheet - Page 104

• Manufacturer Part Number: DF2218BR24V
• Description: IC H8S/2218 MCU FLASH 112-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2218BR24V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-LFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 2.3
Notes: 1. Size refers to the operand size.
Rev.7.00 Dec. 24, 2008 Page 48 of 698
REJ09B0074-0700
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM*
STM*
2
2
2. ER7 is used as a stack pointer in STM and LDM instructions. ER7, therefore, should not
B: Byte
W: Word
L: Longword
be used as a saving (STM) or restoring (LDM) register.
Data Transfer Instructions
Size*
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
Rn → @-SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP.
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
Rn (register list) → @-SP
Pushes two or more general registers onto the stack.