DF2265TE13V Renesas Electronics America, DF2265TE13V Datasheet - Page 560

• Manufacturer Part Number: DF2265TE13V
• Description: IC H8S/2265 MCU FLASH 100TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2265TE13V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 20 ROM
20.3
Block Configuration
Figure 20.5 shows the block configuration of 256-kbyte flash memory of the H8S/2268. Figure
20.6 shows the block configuration of 128-kbyte flash memory of the H8S/2266 and H8S/2265.
The thick lines indicate erasing units, the narrow lines indicate programming units, and the values
are addresses. The flash memory of the H8S/2268 is divided into 4 kbytes (8 blocks), 32 kbytes (1
block), and 64 kbytes (3 blocks). The flash memory of the H8S/2266 and H8S/2265 is divided into
4 kbytes (8 blocks), 32 kbytes (1 block), and 64 kbytes (1 block). Erasing is performed in these
units. Programming is performed in 128-byte units starting from an address with lower eight bits
H'00 or H'80.
Rev. 5.00 Sep. 01, 2009 Page 508 of 656
REJ09B0071-0500