DSPIC33EP128MC504-I/PT Microchip Technology, DSPIC33EP128MC504-I/PT Datasheet - Page 489

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DSPIC33EP128MC504-I/PT

Manufacturer Part Number
DSPIC33EP128MC504-I/PT
Description
Digital Signal Processors & Controllers - DSP, DSC 16B 128KB FL 16KBR 60MHz 44P OpAmps
Manufacturer
Microchip Technology
Type
dsPIC33E/PIC24Er
Datasheet

Specifications of DSPIC33EP128MC504-I/PT

Rohs
yes
Core
dsPIC33E
Data Bus Width
16 bit
Program Memory Size
128 KB
Data Ram Size
16 KB
Maximum Clock Frequency
7.37 MHz, 32 kHz
Number Of Programmable I/os
35
Number Of Timers
5 x 16-bit, 2 x 32-bit
Device Million Instructions Per Second
70 MIPs
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Package / Case
TQFP-44
Mounting Style
SMD/SMT
Family / Core
dsPIC33E/PIC24E
Interface Type
CAN, I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
Yes
Product
DSPs
Program Memory Type
Flash
Supply Current
10 mA

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33EP128MC504-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
 2011-2012 Microchip Technology Inc.
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
L
Dimension Limits
E1
NOTE 2
φ
Units
A2
A1
L1
E1
D1
N
A
E
D
e
L
φ
b
α
β
c
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
Microchip Technology Drawing C04-085B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
DS70657F-page 489
α
A2

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