DSPIC33EP128MC504-I/PT Microchip Technology, DSPIC33EP128MC504-I/PT Datasheet - Page 27

• Manufacturer Part Number: DSPIC33EP128MC504-I/PT
• Description: Digital Signal Processors & Controllers - DSP, DSC 16B 128KB FL 16KBR 60MHz 44P OpAmps
• Manufacturer: Microchip Technology
• Type: dsPIC33E/PIC24Er

Specifications of DSPIC33EP128MC504-I/PT

• Rohs: yes
• Core: dsPIC33E
• Data Bus Width: 16 bit
• Program Memory Size: 128 KB
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 7.37 MHz, 32 kHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5 x 16-bit, 2 x 32-bit
• Device Million Instructions Per Second: 70 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Package / Case: TQFP-44
• Mounting Style: SMD/SMT
• Family / Core: dsPIC33E/PIC24E
• Interface Type: CAN, I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: Yes
• Product: DSPs
• Program Memory Type: Flash
• Supply Current: 10 mA

2.0
2.1
Getting
dsPIC33EPXXXMC20X/50X,
PIC24EPXXXGP/MC20X families requires attention to a
minimal set of device pin connections before proceeding
with development. The following is a list of pin names,
which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
 2011-2012 Microchip Technology Inc.
(see
is not used)
(see
(see
Connection (V
(see
Programming™ (ICSP™) and debugging purposes
(see
source is used
(see
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
CAP
REF
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “CPU Logic Filter Capacitor
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.6 “External Oscillator
+/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS AND
MICROCONTROLLERS
Basic Connection Requirements
started
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of
dsPIC33EPXXXMC20X/50X,
PIC24EPXXXGP/MC20X
devices. It is not intended to be a compre-
hensive reference source. To comple-
ment the information in this data sheet,
refer to the related section of the
“dsPIC33E/PIC24E Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com)
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
- pins are used when external voltage
SS
CAP
with
SS
pins
the
DD
)”)
pins (regardless if ADC module
and AV
the
Pins”)
dsPIC33EPXXXGP50X,
dsPIC33EPXXXGP50X,
SS
Capacitors”)
Capacitors”)
pins must be
families
Pins”)
Pin”)
and
and
of
in
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended to use ceramic capacitors.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, above tens of
MHz, add a second ceramic-type capacitor in
parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB track
inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70657F-page 27
SS
, AV
DD
and