DSPIC33EP128MC504-I/PT Microchip Technology, DSPIC33EP128MC504-I/PT Datasheet - Page 398

• Manufacturer Part Number: DSPIC33EP128MC504-I/PT
• Description: Digital Signal Processors & Controllers - DSP, DSC 16B 128KB FL 16KBR 60MHz 44P OpAmps
• Manufacturer: Microchip Technology
• Type: dsPIC33E/PIC24Er

Specifications of DSPIC33EP128MC504-I/PT

• Rohs: yes
• Core: dsPIC33E
• Data Bus Width: 16 bit
• Program Memory Size: 128 KB
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 7.37 MHz, 32 kHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5 x 16-bit, 2 x 32-bit
• Device Million Instructions Per Second: 70 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Package / Case: TQFP-44
• Mounting Style: SMD/SMT
• Family / Core: dsPIC33E/PIC24E
• Interface Type: CAN, I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: Yes
• Product: DSPs
• Program Memory Type: Flash
• Supply Current: 10 mA

dsPIC33EPXXXGP50X, dsPIC33EPXXXMC20X/50X, AND PIC24EPXXXGP/MC20X
30.1
TABLE 30-1:
TABLE 30-2:
TABLE 30-3:
DS70657F-page 398
Characteristic
Note 1:
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 64-Pin QFN
Package Thermal Resistance, 64-Pin TQFP 10x10 mm
Package Thermal Resistance, 44-Pin QFN
Package Thermal Resistance, 44-Pin TQFP 10x10 mm
Package Thermal Resistance, 44-Pin VTLA 6x6 mm
Package Thermal Resistance, 36-Pin VTLA 5x5 mm
Package Thermal Resistance, 28-Pin QFN-S
Package Thermal Resistance, 28-Pin SSOP
Package Thermal Resistance, 28-Pin SOIC
Package Thermal Resistance, 28-Pin SPDIP
Note 1:
—
—
DC Characteristics
P
I/O =  ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Device is functional at V
Comparator voltage reference will have degraded performance. Device functionality is tested but not
characterized. Refer to parameter
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
2.95V to 3.6V
2.95V to 3.6V
– V
V
DD
(in Volts)
DD
OH
Characteristic
–  I
Range
} x I
Rating
OH
OH
)
(1)
(1)
) +  (V
BORMIN
OL
< V
x I
BO10
DD
OL
< V
-40°C to +125°C
)
-40°C to +85°C
Temp Range
in
DDMIN
Table 30-12
(in °C)
JA
. Analog modules: ADC, Op amp/Comparator, and
(

JA
) numbers are achieved by package simulations.
for the minimum and maximum BOR values.
Symbol
Symbol
P
DMAX










P
T
T
T
T
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33EPXXXMC20X/50X, and
Min.
Typ.
28.0
48.3
29.0
49.8
25.2
28.5
30.0
71.0
69.7
60.0
-40
-40
-40
-40
 2011-2012 Microchip Technology Inc.
PIC24EPXXXGP/MC20X
dsPIC33EPXXXGP50X,
(T
P
Maximum MIPS
INT
J
– T
Max.
Typ.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
+ P
A
)/
70
60
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Max.
+125
+140
+125
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1
1
1
1