H27UAG8T2ATR-BC HYNIX SEMICONDUCTOR, H27UAG8T2ATR-BC Datasheet - Page 57

58T1891

H27UAG8T2ATR-BC

Manufacturer Part Number
H27UAG8T2ATR-BC
Description
58T1891
Manufacturer
HYNIX SEMICONDUCTOR
Datasheet

Specifications of H27UAG8T2ATR-BC

Memory Type
Flash - NAND
Memory Size
16Gbit
Memory Configuration
2048M X 8
Supply Voltage Range
2.7V To 3.6V
Memory Case Style
TSOP
No. Of Pins
48
Operating Temperature Range
0°C To +70°C
Rohs Compliant
Yes

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
HYNIX
Quantity:
2 526
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
SIEMENS
Quantity:
390
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
HYNIX
Quantity:
4 000
Part Number:
H27UAG8T2ATR-BC
Manufacturer:
HYNIX/海力士
Quantity:
20 000
Company:
Part Number:
H27UAG8T2ATR-BC
Quantity:
4 800
Rev 1.0 / Aug. 2010
Figure 58. Ready / Busy
Vcc
GND
Rp value guidence
Rp (min) =
where IL is the sum of the input current of all devices tied to the R/B# pin.
Rp(max) is determined by maximum permissible limit of tr
Device
Vcc (Max.) - V
R/B#
open drain output
I
OL +
Rp
L
300n
200n
100n
OL
(Max.)
ibusy
=
Ready Vcc
3.3
4.2
96
1k
@ Vcc = 3.3V, Ta = 25°C, C
Fig. Rp vs tr, tf & Rp vs ibusy
ibusy
3.2V
tf
tf
189
L
1.65
4.2
2k
16Gb (2048M x 8bit) NAND Flash
V
V
OL
Rp (ohm)
OL
: 0.4V, V
290
4.2
3k
1.1
L
=50pF
Busy
OH
: 2.4V
H27UAG8T2B Series
381
0.825
4.2
4k
tr
3m
2m
1m
V
OH
Release
57

Related parts for H27UAG8T2ATR-BC