MT48H8M32LFB5-75 IT:H Micron Technology Inc, MT48H8M32LFB5-75 IT:H Datasheet - Page 85

• Manufacturer Part Number: MT48H8M32LFB5-75 IT:H
• Description: DRAM Chip Mobile SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA Tray
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M32LFB5-75 IT:H

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 90VFBGA
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 8|6 ns
• Operating Temperature: -40 to 85 °C
• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Package / Case: 90-VFBGA
• Organization: 8Mx32
• Address Bus: 14b
• Access Time (max): 8/6ns
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 100mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision History
Rev. I, Production – 11/09
Rev. H, Production – 10/09
Rev. G, Production – 8/09
Rev. F, Production – 6/09
Rev. E, Production – 4/09
Rev. D, Production – 1/09
Rev. C, Production – 12/08
Rev. B, Preliminary – 10/08
Rev. A, Advance – 9/08
Revision History for Commands, Operations, and Timing Diagrams
Update – 10/08
Update – 7/08
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
• Corrected seating plane value on package dimension drawings from 0.12 to 0.1.
• Changed
• Updated format.
• DC Electrical Characteristics and Operating Conditions table: Updated I
• VFBGA Ball Descriptions table: Removed ball assignments columns.
• AC Functional Characteristics table: Updated note 9.
• Replaced the 8mm x 8mm 54-ball package drawing with an 8mm x 9mm package draw-
• Updated the 90-ball package drawing.
• Changed to Production status.
• I
• Changed to Preliminary status.
• VFBGA Ball Descriptions table: Rearranged table content that was out of order.
• Initial release.
• Deep Power-Down: Added description for exiting DPD.
• Updated address/data range presentation to industry-standard presentation.
Conditions table.
ing.
array 85°C, 1/8 array 45°C, and 1/16 array 45°C.
DD7
Specifications and Conditions (x16 and x32) table: Updated I
t
RFC from 97.5ns to 72ns in the Electrical Specificatins and AC Operating
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
85
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©2008 Micron Technology, Inc. All rights reserved.
Revision History
DD7
values for full
OZ
to ±1.5μA.