MT48H8M32LFB5-75 IT:H Micron Technology Inc, MT48H8M32LFB5-75 IT:H Datasheet - Page 54

• Manufacturer Part Number: MT48H8M32LFB5-75 IT:H
• Description: DRAM Chip Mobile SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA Tray
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M32LFB5-75 IT:H

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 90VFBGA
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 8|6 ns
• Operating Temperature: -40 to 85 °C
• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Package / Case: 90-VFBGA
• Organization: 8Mx32
• Address Bus: 14b
• Access Time (max): 8/6ns
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 100mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 24: READ Continuous Page Burst
Command
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
BA0, BA1
Address
DQM
CKE
A10
CLK
DQ
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
Row
Row
Bank
T0
t CKH
t CMH
t AH
t AH
t AH
t RCD
t CL
T1
Note:
NOP
t CH
t CMS
1. For this example, CL = 2.
t CK
Column m
Bank
T2
READ
t CMH
CAS latency
T3
NOP
t LZ
t AC
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
T4
NOP
D
OUT
t OH
t AC
54
All locations within same row
T5
Full-page burst does not self-terminate.
D
NOP
Can use BURST TERMINATE command.
OUT
t OH
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t AC
Full page completed
T6
NOP
D
OUT
t OH
t AC
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Tn + 1
NOP
D
OUT
t OH
t AC
©2008 Micron Technology, Inc. All rights reserved.
BURST TERM
Tn + 2
READ Operation
D
OUT
t OH
t AC
Tn + 3
NOP
D
OUT
t OH
t HZ
Don’t Care
Undefined
Tn + 4
NOP