MT48H8M32LFB5-75 IT:H Micron Technology Inc, MT48H8M32LFB5-75 IT:H Datasheet - Page 62

• Manufacturer Part Number: MT48H8M32LFB5-75 IT:H
• Description: DRAM Chip Mobile SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA Tray
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M32LFB5-75 IT:H

• Density: 256 Mb
• Maximum Clock Rate: 133 MHz
• Package: 90VFBGA
• Address Bus Width: 14 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 8|6 ns
• Operating Temperature: -40 to 85 °C
• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 133MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Package / Case: 90-VFBGA
• Organization: 8Mx32
• Address Bus: 14b
• Access Time (max): 8/6ns
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.95V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 100mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 33: WRITE – Continuous Page Burst
Command
PDF: 09005aef834c13d2
256mb_mobile_sdram_y36n.pdf - Rev. I 11/09 EN
BA0, BA1
Address
DQM
CKE
A10
CLK
DQ
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
Bank
T0
Row
Row
t CKH
t CMH
t AH
t AH
t AH
t RCD
Notes:
t CL
T1
NOP
t CH
1.
2. Page left open; no
t
WR must be satisfied prior to issuing a PRECHARGE command.
t CMS
t CK
t DS
Column m
D
WRITE
T2
Bank
IN
t CMH
t DH
t DS
256Mb: 16 Meg x 16, 8 Meg x 32 Mobile SDRAM
T3
t
NOP
D
RP.
IN
t DH
62
t DS
T4
NOP
D
IN
All locations within same row
t DH
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Full page completed
t DS
T5
NOP
D
IN
t DH
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t DS
Tn + 1
NOP
D
IN
©2008 Micron Technology, Inc. All rights reserved.
Full-page burst
does not self-terminate.
Use BURST TERMINATE
command to stop. 1, 2
t DH
WRITE Operation
BURST TERM
Tn + 2
Don’t Care
Tn + 3
NOP