M306N4FGTFP Renesas Electronics America, M306N4FGTFP Datasheet - Page 302

IC M16C MCU FLASH 100QFP

M306N4FGTFP

Manufacturer Part Number
M306N4FGTFP
Description
IC M16C MCU FLASH 100QFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/6Nr
Datasheets

Specifications of M306N4FGTFP

Core Processor
M16C/60
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, I²C, IEBus, SIO, UART/USART
Peripherals
DMA, WDT
Number Of I /o
85
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 26x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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M16C/6N Group (M16C/6N4)
Rev.2.40
REJ09B0009-0240
21.5 Parallel I/O Mode
In parallel I/O mode, the user ROM area and the boot ROM area can be rewritten by a parallel programmer
supporting the M16C/6N Group (M16C/6N4). Contact your parallel programmer manufacturer for more
information on the parallel programmer. Refer to the user's manual included with your parallel programmer
for instructions.
21.5.1 User ROM and Boot ROM Areas
21.5.2 ROM Code Protect Function
An erase block operation in the boot ROM area is applied to only one 4-Kbyte block. The rewrite control
program in standard serial I/O and CAN I/O modes are written in the boot ROM area before shipment. Do
not rewrite the boot ROM area if using the serial programmer.
In parallel I/O mode, the boot ROM area is located in addresses 0FF000h to 0FFFFFh. Rewrite this
address range only if rewriting the boot ROM area. (Do not access addresses other than addresses
0FF000h to 0FFFFFh.)
The ROM code protect function prevents the flash memory from being read and rewritten in parallel I/O
mode. (Refer to 21.2 Functions to Prevent Flash Memory from Rewriting.)
Apr 14, 2006
page 278 of 376
21. Flash Memory Version

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