MT46H8M16LFCF-10 Micron Technology Inc, MT46H8M16LFCF-10 Datasheet - Page 66

• Manufacturer Part Number: MT46H8M16LFCF-10
• Description: IC DDR SDRAM 128MBIT 60VFBGA
• Manufacturer: Micron Technology Inc
• Type: DDR SDRAMr

Specifications of MT46H8M16LFCF-10

• Format - Memory: RAM
• Memory Type: Mobile DDR SDRAM
• Memory Size: 128M (8Mx16)
• Speed: 100MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 60-VFBGA
• Organization: 8Mx16
• Density: 128Mb
• Address Bus: 15b
• Access Time (max): 7ns
• Maximum Clock Rate: 104MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 90mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Dimensions
Figure 44:
PDF: 09005aef822b7e27/Source: 09005aef822b7dd6
MT46H8M16LFB_2.fm - Rev. A 5/06 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS Ø 0.42
60X Ø 0.45
SEATING
7.20
PLANE
0.10 C
BALL A9
60-Ball VFBGA Package
Advance: This data sheet contains initial descriptions of products still under development.
3.60
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
1. Dimensions are in millimeters.
3.20
0.80 TYP
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
their respective owners.
0.80 TYP
BALL A1
0.65 ±0.05
BALL A1 ID
5.00 ±0.05
66
10.00 ±0.10
®
128Mb: 8 Meg x 16 Mobile DDR SDRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
SOLDER BALL MATERIAL:
SOLDER BALL PADS:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
PLASTIC LAMINATE
EPOXY NOVOLAC
96.5% Sn, 3% Ag, 0.5% Cu (lead-free)
Ø 0.40 SOLDER MASK DEFINED
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
BALL A1 ID
Advance