MT46H8M16LFCF-10 Micron Technology Inc, MT46H8M16LFCF-10 Datasheet - Page 49

IC DDR SDRAM 128MBIT 60VFBGA

MT46H8M16LFCF-10

Manufacturer Part Number
MT46H8M16LFCF-10
Description
IC DDR SDRAM 128MBIT 60VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheets

Specifications of MT46H8M16LFCF-10

Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
128M (8Mx16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
60-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
15b
Access Time (max)
7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT46H8M16LFCF-10
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 IT
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 IT TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Table 15:
Figure 31:
PDF: 09005aef822b7e27/Source: 09005aef822b7dd6
MT46H8M16LFB_2.fm - Rev. A 5/06 EN
Parameter/Condition
Operating burst write: One bank active; BL = 4;
Continuous WRITE bursts; Address inputs are switching; 50 percent
data changing each burst
Auto refresh: Burst refresh; CKE = HIGH; Address
and control inputs are switching; Data bus inputs
are stable
Precharge power-down standby current: All banks
idle, CKE is LOW; CS is HIGH;
Address and control inputs are switching every two
clock cycles; Data bus inputs are stable
Self refresh: CKE = LOW;
and control inputs are stable; Data bus inputs are
stable
I
Notes: 1–5, 7, 10, 12, 14 notes appear on pages 52–54; V
DD
Typical Self Refresh Current vs. Temperature
Specifications and Conditions (continued)
t
CK =
t
CK =
t
CK (MIN); Address
t
CK (MIN);
t
CK =
t
t
t
Full array, 85°C
Full array, 70°C
Full array, 45°C
Full array, 15°C
Half array, 85°C
Half array, 70°C
Half array, 45°C
Half array, 15°C
1/4 array, 85°C
1/4 array, 70°C
1/4 array, 45°C
1/4 array, 15°C
CK (MIN);
RC =
RC = 15.625µs
TBD
t
49
RC (MIN)
128Mb: 8 Meg x 16 Mobile DDR SDRAM
DD
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Q = +1.8 ±0.1V, V
Symbol
I
I
I
I
I
I
I
I
I
I
I
DD
I
I
I
I
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
4W
6b
6d
6b
6d
6b
6d
5a
6a
6c
6a
6c
6a
6c
5
105
-75
95
5
Max
Electrical Specifications
DD
300
220
180
160
220
180
160
150
180
160
150
145
= +1.8 ±0.1V
100
-10
90
©2006 Micron Technology, Inc. All rights reserved.
5
Units
mA
mA
mA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
Notes
Advance
24, 38
11, 39
11, 39
11, 39
11, 39
11, 39
11, 39
11, 39
11, 39
11, 39
11, 39
11, 39
11, 39
19
38

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