MT46H8M16LFCF-10 Micron Technology Inc, MT46H8M16LFCF-10 Datasheet - Page 46

IC DDR SDRAM 128MBIT 60VFBGA

MT46H8M16LFCF-10

Manufacturer Part Number
MT46H8M16LFCF-10
Description
IC DDR SDRAM 128MBIT 60VFBGA
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheets

Specifications of MT46H8M16LFCF-10

Format - Memory
RAM
Memory Type
Mobile DDR SDRAM
Memory Size
128M (8Mx16)
Speed
100MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
60-VFBGA
Organization
8Mx16
Density
128Mb
Address Bus
15b
Access Time (max)
7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
90mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
MT46H8M16LFCF-10
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 IT
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 IT TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT46H8M16LFCF-10 TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
PDF: 09005aef822b7e27/Source: 09005aef822b7dd6
MT46H8M16LFB_2.fm - Rev. A 5/06 EN
4. AUTO REFRESH and LOAD MODE REGISTER commands may only be issued when all banks
5. A BURST TERMINATE command cannot be issued to another bank; it applies to the bank
6. All states and sequences not shown are illegal or reserved.
7. READs or WRITEs listed in the Command/Action column include READs or WRITEs with auto
8. Requires appropriate DM masking.
9. A WRITE command may be applied after the completion of the READ burst; otherwise, a
3b. The minimum delay from a READ or WRITE command with auto precharge
CL
BL = Bust length
are idle.
represented by the current state only.
precharge enabled and READs or WRITEs with auto precharge disabled.
BURST TERMINATE must be used to end the READ burst prior to asserting a
WRITE command.
t
period starts with registration of the command and ends where the precharge
period (or
This device supports concurrent auto precharge such that when a read with
auto precharge enabled or a write with auto precharge is enabled any com-
mand to other banks is allowed, long as that command does not interrupt the
read or write data transfer already in process. either case, all other related lim-
itations apply (e.g., contention between read data and write data must be
avoided).
enabled, to a command to a different bank is summarized below.
WR ends, with
RU
= CAS latency (CL) rounded up to the next integer
From Command
WRITE w/AP
READ w/AP
t
RP) begins.
t
WR measured as if auto precharge was disabled. The access
46
READ or READ w/AP
WRITE or WRITE w/AP
PRECHARGE
ACTIVE
READ or READ w/AP
WRITE or WRITE w/AP
PRECHARGE
ACTIVE
128Mb: 8 Meg x 16 Mobile DDR SDRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
To Command
©2006 Micron Technology, Inc. All rights reserved.
(with Concurrent Auto
[1 + (BL/2)]
[CL
Minimum Delay
Precharge)
RU
(BL/2) ×
(BL/2)
+ (BL/2)]
1
1
1
1
Truth Tables
t
t
t
t
CK
CK
CK
CK
t
CK +
t
CK
t
CK
t
t
Advance
CK
WTR

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