DAC1408D650HW/C1 NXP [NXP Semiconductors], DAC1408D650HW/C1 Datasheet - Page 16
![no-image](/images/no-image-200.jpg)
DAC1408D650HW/C1
Manufacturer Part Number
DAC1408D650HW/C1
Description
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.DAC1408D650HWC1.pdf
(88 pages)
- Current page: 16 of 88
- Download datasheet (361Kb)
NXP Semiconductors
DAC1408D650_1
Objective data sheet
Fig 5.
data in +
data in
DC coupling
10.2.2 Sync & word align
50
The common mode voltage is programmable. See
map”
DC coupling is only possible if both DAC and transmitter have the same common mode
voltage. Else, AC coupling is required.
The deserializer performs the incoming data clock recovery and also the serial to parallel
conversion. Therefore, each lane includes its own PLL that must first lock.
Then the clock alignment module transfers the data from the re-generated clock to the
frame clock domain. The frequency of both clocks are the same but the phase relation
between the clocks isn’t known.
As stated in JESD204A, transmitter and receiver have to first synchronize. This is
achieved through SYNC_OUT signals and SYNC pattern (K28.5 symbol).
The receiver (i.e. DAC1408D650) first drives its SYNC outputs. The SYNC signal/pattern
is continuously sent until the receiver deasserts the SYNC signal.
The Lane Processing makes use of the SYNC-patterns to synchronize the datastream,
determine the initial running disparity and to extract the 10 bits word from the incoming
datastream (word-alignment).
Fig 4.
50
for register value.
Zdiff = 100
Lane input termination
50
001aak162
50
Rev. 01 — 26 May 2009
Dual 14-bit DAC, up to 650 Msps, 2 and 4 interpolating
Vin_p
Vin_n
Fig 6.
data in +
data in
50
50
AC coupling
Vtt
Ztt
001aak166
Table 39 “Page 2 register allocation
V
50
DD1
50
DAC1408D650
Zdiff = 100
© NXP B.V. 2009. All rights reserved.
V
50
DD2
001aak163
50
16 of 88
Related parts for DAC1408D650HW/C1
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![DAC1408](/images/no-image3.png)
Part Number:
Description:
8 Bit Multiplying D/A Converter
Manufacturer:
Fairchild
Datasheet:
![LPC2420_60](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2458](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2468](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2470](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC2478](/images/manufacturer_photos/0/4/487/nxp_semiconductors_tmb.jpg)
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
![LH75401_LH75411_N](/photos/41/52/415297/sot486-1_3d_tmb.gif)
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC3130_3131](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
![LPC3141FET180](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![LPC3143FET180](/photos/41/52/415299/sot570-3_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![LPC3152FET208](/photos/41/53/415307/sot930-1_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![LPC3154FET208](/photos/41/53/415307/sot930-1_3d_tmb.gif)
Part Number:
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
![BUK714R1-40BT](/photos/41/53/415317/sot426_3d_tmb.gif)
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
![BUK7210-55B](/photos/41/50/415037/sot428_3d_tmb.gif)
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet:
![BUK754R0-55B](/photos/41/53/415315/sot078a_3d_tmb.gif)
Part Number:
Description:
Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using NXP High-Performance Automotive (HPA) TrenchMOS technology
Manufacturer:
NXP Semiconductors
Datasheet: