mt47h64m16hw-3 Micron Semiconductor Products, mt47h64m16hw-3 Datasheet - Page 21

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mt47h64m16hw-3

Manufacturer Part Number
mt47h64m16hw-3
Description
1gb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet

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Figure 12:
PDF: 09005aef821ae8bf/Source: 09005aef821aed36
1Gb_DDR2_x4x8x16_D2.fm - 1Gb DDR2: Rev. N; Core DDR2: Rev. C 4/08 EN
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION.
92X Ø 0.45
Seating
0.12 A
plane
16
92-Ball FBGA Package – x4, x8, x16
Notes:
A
1. All dimensions are in millimeters.
6.40
11 ±0.15
0.80
TYP
C L
C L
0.8 ±0.1
2.40
0.80
TYP
21
BALL A1 ID
19 ±0.15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
0.25 MIN
1Gb: x4, x8, x16 DDR2 SDRAM
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
BALL A1 ID

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