mt47h64m16hw-3 Micron Semiconductor Products, mt47h64m16hw-3 Datasheet - Page 20

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mt47h64m16hw-3

Manufacturer Part Number
mt47h64m16hw-3
Description
1gb X4, X8, X16 Ddr2 Sdram
Manufacturer
Micron Semiconductor Products
Datasheet

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Figure 11:
PDF: 09005aef821ae8bf/Source: 09005aef821aed36
1Gb_DDR2_x4x8x16_D2.fm - 1Gb DDR2: Rev. N; Core DDR2: Rev. C 4/08 EN
84X Ø0.45
11.2 CTR
Dimensions
apply to solder
balls post reflow
on Ø0.33 NSMD
ball pads.
Seating
plane
0.12 A
84-Ball FBGA Package – x16
0.8 TYP
0.8 TYP
Notes:
A
9
1. All dimensions are in millimeters.
8
7
6.4 CTR
8 ±0.15
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 ±0.1
Exposed
gold-plated pad
1.0mm (MAX) X
0.7mm (NOM)
12.5 ±0.15
Ball A1 ID
20
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.2 MAX
0.25 MIN
1Gb: x4, x8, x16 DDR2 SDRAM
Package Dimensions
©2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID

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