GD82559C S L3DF Intel, GD82559C S L3DF Datasheet - Page 117

• Manufacturer Part Number: GD82559C S L3DF
• Manufacturer: Intel

Specifications of GD82559C S L3DF

• Lead Free Status / Rohs Status: Not Compliant

13.0
13.1
Datasheet
Figure 37. Dimension Diagram for the 82559 196-pin BGA
Package and Pinout Information
Package Information
The 82559 is a 196-pin Ball Grid Array (BGA) package. Package dimensions are shown in
37. More information on Intel device packaging is available in the Intel Packaging Handbook,
which is available from the Intel Literature Center or your local Intel sales office.
Networking Silicon — 82559
Figure
109