N25Q128A11B1240E NUMONYX, N25Q128A11B1240E Datasheet - Page 182

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N25Q128A11B1240E

Manufacturer Part Number
N25Q128A11B1240E
Description
Manufacturer
NUMONYX
Datasheet

Specifications of N25Q128A11B1240E

Cell Type
NOR
Density
128Mb
Access Time (max)
7ns
Interface Type
Serial (SPI)
Boot Type
Bottom
Address Bus
1b
Operating Supply Voltage (typ)
1.8V
Operating Temp Range
-40C to 85C
Package Type
TBGA
Program/erase Volt (typ)
1.7 to 2/8.5 to 9.5V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.7V
Operating Supply Voltage (max)
2V
Word Size
8b
Number Of Words
16M
Supply Current
20mA
Mounting
Surface Mount
Pin Count
24
Lead Free Status / Rohs Status
Supplier Unconfirmed
16
Note:
Table 38.
1. Additional secure options are available upon customer request.
182/185
Example:
Device type
N25Q = serial Flash memory, Quad I/O, XiP
Device density
128 = 128 Mbit
Technology
A = 65 nm
Feature set
1 = Byte addressability, Hold pin, Numonyx XiP
2 = Byte addressability, Hold pin, Basic XiP
3 = Byte addressability, Reset pin, Numonyx XiP
4 = Byte addressability, Reset pin, Basic XiP
Operating voltage
1 = VCC = 1.7 V to 2 V
Block Structure
B = Bottom
T = Top
E = Uniform (no boot sectors)
Package
F8 = VDFPN8 8 x 6 mm (MLP8) (RoHS compliant)
SF = SO16 (300 mils width) (RoHS compliant)
12 = TBGA24 6 x 8 mm (RoHS compliant)
Temperature and test flow
4 = Industrial temperature range, –40 to 85 °C
A = Automotive temperature range, –40 to 125 °C
H = Industrial temperature range, –40 to 85 °C
Security features
0 = No extra security
Packing options
E = Tray packing
F = Tape and reel packing
G = Tube packing
Device tested with standard test flow
Device tested with high reliability certified test flow
Device tested with high reliability certified test flow
Ordering information
For further information on line items not listed here or on any aspect of this device, please
contact your nearest Numonyx Sales Office.
Ordering information scheme
(1)
N25Q128
A 1 1
B
F8 4
0
E

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