MC9S12XDT512MAA Freescale, MC9S12XDT512MAA Datasheet - Page 730
MC9S12XDT512MAA
Manufacturer Part Number
MC9S12XDT512MAA
Description
Manufacturer
Freescale
Datasheet
1.MC9S12XDT512MAA.pdf
(1348 pages)
Specifications of MC9S12XDT512MAA
Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C/SCI/SPI
Total Internal Ram Size
32KB
# I/os (max)
59
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
80
Package Type
PQFP
Program Memory Type
Flash
Program Memory Size
512KB
Lead Free Status / RoHS Status
Compliant
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S12XDT512MAA
Manufacturer:
Freescale Semiconductor
Quantity:
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Chapter 19 S12X Debug (S12XDBGV2) Module
When program control returns from a tagged breakpoint using an RTI or BDM GO command without
program counter modification it will return to the instruction whose tag generated the breakpoint. Thus
care must be taken to avoid re triggering a breakpoint at the same location. This can be done by
reconfiguring the DBG module in the SWI routine, (SWI configuration), or by executing a TRACE
command before the GO (BDM configuration) to increment the program flow past the tagged instruction.
Comparators should not be configured for the vector address range while tagging, since these addresses
are not opcode addresses
MC9S12XDP512 Data Sheet, Rev. 2.21
732
Freescale Semiconductor
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