R8A77850BDBGV#RD0Z Renesas Electronics America, R8A77850BDBGV#RD0Z Datasheet - Page 1476

IC SUPERH MPU ROMLESS 436BGA

R8A77850BDBGV#RD0Z

Manufacturer Part Number
R8A77850BDBGV#RD0Z
Description
IC SUPERH MPU ROMLESS 436BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7780r
Datasheet

Specifications of R8A77850BDBGV#RD0Z

Core Processor
SH-4A
Core Size
32-Bit
Speed
600MHz
Connectivity
Audio Codec, MMC, Serial Sound, SCI, SIO, SPI, SSI
Peripherals
DMA, POR, WDT
Number Of I /o
108
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1 V ~ 1.2 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
436-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
R8A77850BDBGV#RD0Z
Manufacturer:
Renesas Electronics America
Quantity:
10 000
28. General Purpose I/O Ports (GPIO)
Rev.1.00 Jan. 10, 2008 Page 1444 of 1658
REJ09B0261-0100
Bit
12
11
10
9
8
7
Bit Name
PMSEL12
PMSEL11
P1MSEL10
PMSEL9
P1MSEL8
P1MSEL7
Initial
value
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Description
Out of the modules DMAC, SCIF[2], MMCIF, and SIOF,
selects the one uses the pins
DACK3/SCIF2_SCK/MMCDAT/SIOF_SCK and
DACK2/SCIF2_TXD/MMCCMD/SIOF_TXD.
00: DMAC
01: SIOF*
10: SCIF[2]
11: MMCIF
Out of the modules DMAC and LBSC, selects the one
which uses the pins MODE12/DRAK3/CE2B and
DRAK2/CE2A.
0: DMAC
1: LBSC
At power-on reset by the PRESET pin, MODE12 is
selected.
Out of the modules TMU and LBSC, selects the one
which uses the MODE13/TCLK/IOIS16 pin.
0: TMU
1: LBSC
At power-on reset by the PRESET pin, MODE13 is
selected.
Out of the modules SCIF[0], HSPI, and FLCTL, selects
the one which uses the pins
SCIF0_TXD/HSPI_TX/FWE,
SCIF0_RXD/HSPI_RX/FRB,
SCIF0_SCK/HSPI_CLK/FRE,
SCIF0_RTS/HSPI_CS/FSE, and
SCIF0_CTS/INTD/FCE.
00: SCIF0
01: HSPI, PCIC
10: FLCTL
11: SCIF0, PCIC
When 11 is selected, the SCIF0_CTS/INTD/FCE pin is
used as the PCIC pin.

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