R8A77850ADBGV#RD0Z Renesas Electronics America, R8A77850ADBGV#RD0Z Datasheet - Page 31

• Manufacturer Part Number: R8A77850ADBGV#RD0Z
• Description: IC SUPERH MPU ROMLESS 436-BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7780r

Specifications of R8A77850ADBGV#RD0Z

• Core Processor: SH-4A
• Core Size: 32-Bit
• Speed: 600MHz
• Connectivity: Audio Codec, MMC, Serial Sound, SCI, SIO, SPI, SSI
• Peripherals: DMA, POR, WDT
• Number Of I /o: 108
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1 V ~ 1.2 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 436-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

30.4 Operation ......................................................................................................................... 1503
30.5 Usage Notes ..................................................................................................................... 1507
Section 31 Register List
31.1 Register Address List....................................................................................................... 1509
31.2 States of the Registers in the Individual Operating Modes .............................................. 1533
Section 32 Electrical Characteristics
32.1 Absolute Maximum Ratings ............................................................................................ 1561
32.2 DC Characteristics ........................................................................................................... 1562
32.3 AC Characteristics ........................................................................................................... 1567
32.4 AC Characteristic Test Conditions................................................................................... 1625
30.3.2
30.3.3
30.3.4
30.4.1
30.4.2
30.4.3
30.4.4
32.3.1
32.3.2
32.3.3
32.3.4
32.3.5
32.3.6
32.3.7
32.3.8
32.3.9
32.3.10 H-UDI Module Signal Timing.......................................................................... 1605
32.3.11 GPIO Signal Timing ......................................................................................... 1607
32.3.12 HSPI Module Signal Timing ............................................................................ 1608
32.3.13 SIOF Module Signal Timing ............................................................................ 1609
32.3.14 MMCIF Module Signal Timing........................................................................ 1613
32.3.15 HAC Interface Module Signal Timing.............................................................. 1614
32.3.16 SSI Interface Module Signal Timing ................................................................ 1616
32.3.17 FLCTL Module Signal Timing......................................................................... 1618
32.3.18 Display Unit Signal Timing.............................................................................. 1622
Interrupt Source Register (SDINT)................................................................... 1492
Bypass Register (SDBPR) ................................................................................ 1493
Boundary Scan Register (SDBSR) ................................................................... 1493
Boundary-Scan TAP Controller (IDCODE, EXTEST, SAMPLE/PRELOAD,
and BYPASS) ................................................................................................... 1503
TAP Control...................................................................................................... 1505
H-UDI Reset ..................................................................................................... 1506
H-UDI Interrupt ................................................................................................ 1507
Clock and Control Signal Timing ..................................................................... 1568
Control Signal Timing ...................................................................................... 1572
Bus Timing ....................................................................................................... 1574
DBSC2 Signal Timing ...................................................................................... 1592
INTC Module Signal Timing............................................................................ 1597
PCIC Module Signal Timing ............................................................................ 1599
DMAC Module Signal Timing ......................................................................... 1601
TMU Module Signal Timing ............................................................................ 1602
SCIF Module Signal Timing............................................................................. 1603
.................................................................................................... 1509
............................................................................ 1561
Rev.1.00 Jan. 10, 2008 Page xxix of xxx
REJ09B0261-0100