D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 528

• Manufacturer Part Number: D13002F16V
• Description: IC H8/3002 ROMLESS 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13002F16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

17.2 Register Configuration
The H8/3002’s system control register (SYSCR) controls the power-down state. Table 17-2
summarizes this register.
Table 17-2 Control Register
Address*
H'FFF2
Note: * Lower 16 bits of the address.
17.2.1 System Control Register (SYSCR)
SYSCR is an 8-bit readable/writable register. Bit 7 (SSBY) and bits 6 to 4 (STS2 to STS0) control
the power-down state. For information on the other SYSCR bits, see section 3.3, System Control
Register.
Bit
Initial value
Read/Write
Name
System control register
SSBY
Software standby
Enables transition to
software standby mode
R/W
7
0
STS2
R/W
6
0
STS1
Standby timer select 2 to 0
These bits select the
waiting time at exit from
software standby mode
R/W
5
0
Abbreviation
SYSCR
514
STS0
R/W
4
0
User bit enable
R/W
UE
3
1
R/W
R/W
NMIEG
NMI edge select
R/W
2
0
Initial Value
H'0B
Reserved bit
—
—
1
1
RAM enable
RAME
R/W
0
1