D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 171

• Manufacturer Part Number: D13002F16V
• Description: IC H8/3002 ROMLESS 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13002F16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Self-Refresh Mode: Some DRAM devices have a self-refresh function. After the SRFMD bit is
set to 1 in RFSHCR, when a transition to software standby mode occurs, the CAS and RAS
outputs go low in that order so that the DRAM self-refresh function can be used. On exit from
software standby mode, the CAS and RAS outputs both go high.
Table 7-7 shows the pin states in software standby mode. Figure 7-6 shows the signal output
timing.
Table 7-7 Pin States in Software Standby Mode (1) (PSRAME = 0, DRAME = 1)
Signal
HWR
LWR
RD
CS
RFSH
3
CAS/WE = 0
High-impedance
High-impedance
High-impedance
High
High
SRFMD = 0
CAS/WE = 1
High-impedance
High-impedance
High-impedance
High
High
Software Standby Mode
154
CAS/WE = 0
High
High
Low
Low
Low
SRFMD = 1 (self-refresh mode)
CAS/WE = 1
Low
Low
High
Low
Low