D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 194

• Manufacturer Part Number: D13002F16V
• Description: IC H8/3002 ROMLESS 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13002F16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 38
• Program Memory Type: ROMless
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

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BREQ
BACK
Address
bus
Strobe
If a bus cycle is prolonged by insertion of wait states, the first refresh request is held, as in the
bus-released state.
If contention occurs between a transition to software standby mode and a bus request from an
external bus master, the bus may be released for one state just before the transition to
software standby mode (see figure 7-25). When using software standby mode, clear the
BRLE bit to 0 in BRCR before executing the SLEEP instruction.
If similar contention occurs in a transition to self-refresh mode, strobe waveforms may not be
output correctly. This can also be prevented by clearing the BRLE bit to 0 in BRCR.
Figure 7-25 Contention between Bus-Released State and Software Standby Mode
Bus-released state
177
Software standby mode