D13002F16V Renesas Electronics America, D13002F16V Datasheet - Page 482

IC H8/3002 ROMLESS 100QFP

D13002F16V

Manufacturer Part Number
D13002F16V
Description
IC H8/3002 ROMLESS 100QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of D13002F16V

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
DMA, PWM, WDT
Number Of I /o
38
Program Memory Type
ROMless
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D13002F16V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Transmitting Serial Data (Synchronous Mode): Figure 13-16 shows a sample flowchart for
transmitting serial data and indicates the procedure to follow.
TDR and clear TDRE flag
Read TDRE flag in SSR
Read TEND flag in SSR
Clear TE bit to 0 in SCR
Write transmit data in
Start transmitting
transmitted?
to 0 in SSR
TDRE = 1?
TEND = 1?
Initialize
All data
End
Yes
Yes
Yes
Figure 13-16 Sample Flowchart for Serial Transmitting
No
No
No
1
2
3
1.
2.
3.
466
SCI initialization: the transmit data output function
of the TxD pin is selected automatically.
SCI status check and transmit data write: read SSR,
check that the TDRE flag is 1, then write transmit
data in TDR and clear the TDRE flag to 0.
To continue transmitting serial data: after checking
that the TDRE flag is 1, indicating that data can be
written, write data in TDR, then clear the TDRE flag
to 0. When the DMAC is activated by a transmit-
data-empty interrupt request (TXI) to write data in
TDR, the TDRE flag is checked and cleared
automatically.

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