W971GG6JB-25 Winbond Electronics, W971GG6JB-25 Datasheet - Page 86

• Manufacturer Part Number: W971GG6JB-25
• Description: IC DDR2-800 SDRAM 1GB 84-WBGA
• Manufacturer: Winbond Electronics

Specifications of W971GG6JB-25

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 1G (64M x 16)
• Speed: 2.5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 84-WBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: Q5804012

11. PACKAGE SPECIFICATION
Package Outline WBGA-84 (8x12.5 mm
SOLDER BALL DIAMETER REFERS.
TO POST REFLOW CONDITION.
84xΦb
9
eE
8
7
SYMBOL
aaa
bbb
ccc
D1
eD
A1
E1
eE
A
D
E
b
E1
THE WINDOW-SIDE
ENCAPSULANT
12.40
MIN.
0.25
0.40
7.90
3
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---
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DIMENSION (MM)
2
11.20 BSC.
6.40 BSC.
0.80 BSC.
0.80 BSC.
1
12.50
NOM.
8.00
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---
---
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PIN A1 INDEX
A
B
C
D
E
F
G
H
K
N
P
R
J
L
M
12.60
A1
MAX.
0.20
0.15
0.10
1.20
0.40
0.50
8.10
SEATING PLANE
C
2
A
)
- 86 -
ccc
//
C
PIN A1 INDEX
bbb
C
A
Note: 1. Ball land : 0.5mm
Publication Release Date: Mar. 28, 2011
2. Ball opening : 0.4mm
3. PCB Ball land suggested ≤ 0.4mm
Ball Opening
Ball Land
E
W971GG6JB
Revision A07
B
aaa
C
4X