mpc8569e Freescale Semiconductor, Inc, mpc8569e Datasheet - Page 120

• Manufacturer Part Number: mpc8569e
• Description: Mpc8569e Powerquicc Iii Integrated Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Package Parameters for the MPC8569E
The following figure depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit
board.
The heat sink removes most of the heat from the device. Heat generated on the active side of the chip is conducted through the
silicon and the heat sink attach material (or thermal interface material), and to the heat sink. The junction-to-case thermal
resistance is low enough that the heat sink attach material and heat sink thermal resistance are the dominant terms.
3.3.2
A thermal interface material is required at the package-to-heat sink interface to minimize the thermal contact resistance. The
performance of thermal interface materials improves with increased contact pressure; this performance characteristic chart is
generally provided by the thermal interface vendor. The recommended method of mounting heat sinks on the package is by
means of a spring clip attachment to the printed-circuit board (see
The system board designer can choose among several types of commercially-available thermal interface materials.
4
The following section describes the detailed content and mechanical description of the package.
4.1
The following table provides the package parameters for the FC-PBGA. The package type is 29 mm × 29 mm, 783 plastic ball
grid array (FC-PBGA).
120
Package Description
Package Parameters for the MPC8569E
Thermal Interface Materials
(Note the internal versus external package resistance.)
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
External Resistance
External Resistance
Internal Resistance
Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board
Package outline
Printed-Circuit Board
Table 82. Package Parameters
Parameter
Heat Sink
Radiation
Radiation
Figure
29 mm × 29 mm
Convection
Convection
73).
PBGA
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
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