mpc8569e Freescale Semiconductor, Inc, mpc8569e Datasheet - Page 119

• Manufacturer Part Number: mpc8569e
• Description: Mpc8569e Powerquicc Iii Integrated Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

3.3
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,
and thermal interface material.
The recommended attachment method to the heat sink is illustrated in the following figure. The heat sink must be attached to
the printed-circuit board with the spring force centered over the package. This spring force should not exceed 10 pounds force
(45 Newtons).
The system board designer can choose among several types of commercially-available heat sinks to determine the appropriate
one to place on the device. Ultimately, the final selection of an appropriate heat sink depends on factors such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
3.3.1
For the package, the intrinsic internal conduction thermal resistance paths are as follows:
Freescale Semiconductor
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The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
Thermal Management Information
Internal Package Conduction Resistance
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Thermal Interface Material
Printed-Circuit Board
Figure 73. Package Exploded Cross-Sectional View
Adhesive or
Heat Sink
Heat Sink
Clip
FC-PBGA Package
Thermal Management Information
Die
Die Lid
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