SAM3U2E Atmel Corporation, SAM3U2E Datasheet - Page 390

• Manufacturer Part Number: SAM3U2E
• Manufacturer: Atmel Corporation

Specifications of SAM3U2E

• Flash (kbytes): 128 Kbytes
• Pin Count: 144
• Max. Operating Frequency: 96 MHz
• Cpu: Cortex-M3
• # Of Touch Channels: 57
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 1
• Quadrature Decoder Channels: 1
• Usb Speed: Hi-Speed
• Usb Interface: Device
• Spi: 5
• Twi (i2c): 2
• Uart: 5
• Ssc: 1
• Sd / Emmc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 16
• Adc Resolution (bits): 12
• Adc Speed (ksps): 384
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 36
• Self Program Memory: YES
• External Bus Interface: 1
• Dram Memory: No
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.62 to 3.6
• Fpu: No
• Mpu / Mmu: Yes / No
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

Figure 25-34. Read Enable Timing Configuration Working with NAND Flash Device
Figure 25-35. Ready/Busy Timing Configuration
390
390
mck
cle
mck
wen
cen
ale
ren
ren
rbn
SAM3U Series
SAM3U Series
Use TWB field in SMC_TIMINGS register to configure the maximum elapsed time between the
rising edge of wen signal and the falling edge of rbn signal. Use TRR field in the SMC_TIMINGS
register to program the number of clock cycle between the rising edge of the rbn signal and the
falling edge of ren signal.
• Ready/Busy Signal Timing configuration working with a NAND Flash device
t
WB
t
AR
busy
t
CLR
t
REN_SETUP
t
REN_CYCLE
t
t
REN_PULSE
RR
t
REH
6430E–ATARM–29-Aug-11
6430E–ATARM–29-Aug-11