SAM3U2E Atmel Corporation, SAM3U2E Datasheet - Page 338

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SAM3U2E

Manufacturer Part Number
SAM3U2E
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM3U2E

Flash (kbytes)
128 Kbytes
Pin Count
144
Max. Operating Frequency
96 MHz
Cpu
Cortex-M3
# Of Touch Channels
57
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Hi-Speed
Usb Interface
Device
Spi
5
Twi (i2c)
2
Uart
5
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
16
Adc Resolution (bits)
12
Adc Speed (ksps)
384
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
36
Self Program Memory
YES
External Bus Interface
1
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
23.5
338
Hardware and Software Constraints
SAM3U Series
Table 23-4.
Peripheral
UART
UART
• SAM-BA Boot uses the first 2048 bytes of the SRAM for variables and stacks. The remaining
• USB requirements:
available size can be used for user's code.
/* build the command to send to EEFC */
/* Call the IAP function with appropriate command */
}
– 12.000 MHz Quartz or 12.000 MHz external clock on XIN. 12 MHz must be
±500 ppm and 1.8V Square Wave Signal.
flash_cmd =
flash_status = IAP_Function (EFCIndex, flash_cmd);
Pins Driven during Boot Program Execution
(0x5A << 24) | (FlashSectorNum << 8) | AT91C_MC_FCMD_EWP;
Pin
URXD
UTXD
PIO Line
PA11
PA12
6430E–ATARM–29-Aug-11

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