SAM3U2E Atmel Corporation, SAM3U2E Datasheet - Page 1155

• Manufacturer Part Number: SAM3U2E
• Manufacturer: Atmel Corporation

Specifications of SAM3U2E

• Flash (kbytes): 128 Kbytes
• Pin Count: 144
• Max. Operating Frequency: 96 MHz
• Cpu: Cortex-M3
• # Of Touch Channels: 57
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 1
• Quadrature Decoder Channels: 1
• Usb Speed: Hi-Speed
• Usb Interface: Device
• Spi: 5
• Twi (i2c): 2
• Uart: 5
• Ssc: 1
• Sd / Emmc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 16
• Adc Resolution (bits): 12
• Adc Speed (ksps): 384
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 36
• Self Program Memory: YES
• External Bus Interface: 1
• Dram Memory: No
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.62 to 3.6
• Fpu: No
• Mpu / Mmu: Yes / No
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

44.4
Figure 44-4. 144-ball LFBGA Package Drawing
Table 44-11. Soldering Information (Substrate Level)
Table 44-12. Device and 144-ball BGA Package Maximum Weight
Table 44-13. 144-ball BGA Package Characteristics
Table 44-14.
6430E–ATARM–29-Aug-11
Ball Land
Soldering Mask Opening
300
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
144-ball LFBGA Package
All dimensions are in mm.
This package respects the recommendations of the NEMI User Group.
0.380 mm
0.280 mm
mg
3
none
e1
SAM3U Series
1155