TWR-K60N512-KEIL Freescale Semiconductor, TWR-K60N512-KEIL Datasheet - Page 19
TWR-K60N512-KEIL
Manufacturer Part Number
TWR-K60N512-KEIL
Description
K60N512 Keil Tower Kit
Manufacturer
Freescale Semiconductor
Series
Kinetisr
Type
MCUr
Datasheets
1.TWR-ELEV.pdf
(4 pages)
2.TWR-K60N512-KIT.pdf
(8 pages)
3.TWR-K60N512-KIT.pdf
(17 pages)
4.TWR-K60N512-KEIL.pdf
(181 pages)
Specifications of TWR-K60N512-KEIL
Rohs Compliant
YES
Contents
4 Boards, Documentation, DVD
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
Freescale Tower System, K60N512
- TWR-ELEV PDF datasheet
- TWR-K60N512-KIT PDF datasheet #2
- TWR-K60N512-KIT PDF datasheet #3
- TWR-K60N512-KEIL PDF datasheet #4
- Current page: 19 of 181
- Download datasheet (3Mb)
Chapter 2
General System Setup (Hardware Considerations)
2.1 Overview
This chapter will outline the best practices for hardware design when using the Kinetis
MCUs. The designer must consider numerous aspects when creating the system so that
performance, cost, and quality meet the end-user expectations. Performance usually
implies high speed digital signalling, but it also applies to accurate sampling of analog
signals. Cost is influenced by component selection, of which the PCB may be the most
expensive element. Quality involves manufacturability, reliability, and conformance to
industry or governmental standards.
The Freescale Tower Systems are great for evaluating the operation and performance of
the many features of Freescale MCUs. However, evaluation systems are not ideal
examples for implementation of robust system design techniques. This document will
mention some of the hardware techniques found on the Freescale Tower Systems, and
will give recommendations that are more appropriate to conventional systems that are not
required to implement all of the feature options.
2.2 Floorplan
The organization of the printed circuit board (PCB) depends on many factors. Typically,
there are connectors, mechanical components, high speed signals, low speed signals,
switches, and power domains, among others, that need to be considered. While placement
of connectors and some mechanical components (switches, relays, etc) is critical to the
end product’s form, there are some basic recommendations that can significantly affect
the electrical performance and electromagnetic compatibility (EMC) of the PCB
assembly.
Kinetis Quick Reference User Guide, Rev. 0, 11/2010
Freescale Semiconductor
19
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