WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 8

• Manufacturer Part Number: WG82574L S LBA8
• Manufacturer: Intel

Specifications of WG82574L S LBA8

• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

14.0 Thermal Design Considerations.............................................................................. 452
15.0 Board Layout and Schematic Checklists ................................................................. 460
16.0 Models ................................................................................................................... 470
17.0 Reference Schematics ............................................................................................ 472
8
13.6
13.7
13.8
13.9
13.10 XOR Testing .................................................................................................... 450
14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9
14.10 Reliability ....................................................................................................... 456
14.11 Measurements for Thermal Specifications............................................................ 457
14.12 Case Temperature Measurements ...................................................................... 457
14.13 Conclusion ...................................................................................................... 458
14.14 PCB Guidelines ................................................................................................ 459
13.5.5 Layout Considerations for the Ethernet Interface....................................... 431
13.5.6 Physical Layer Conformance Testing ........................................................ 437
13.5.7 Troubleshooting Common Physical Layout Issues ...................................... 437
SMBus and NC-SI ............................................................................................ 438
13.6.1 NC-SI Electrical Interface Requirements................................................... 439
82574 Power Supplies ...................................................................................... 443
13.7.1 82574 GbE Controller Power Sequencing.................................................. 443
13.7.2 Power and Ground Planes ...................................................................... 445
Device Disable................................................................................................. 445
13.8.1 BIOS Handling of Device Disable ............................................................. 446
82574 Exposed Pad* ........................................................................................ 446
13.9.1 Introduction ......................................................................................... 446
13.9.2 Component Pad, Solder Mask and Solder Paste ......................................... 447
13.9.3 Landing Pattern A (No Via In Pad) ........................................................... 448
13.9.4 Landing Pattern B (Thermal Relief; No Via In Pad)..................................... 449
Introduction .................................................................................................... 452
Intended Audience ........................................................................................... 452
Measuring the Thermal Conditions ..................................................................... 452
Thermal Considerations .................................................................................... 452
Packaging Terminology ..................................................................................... 453
Product Package Thermal Specification ............................................................... 453
Thermal Specifications...................................................................................... 454
14.7.1 Case Temperature ................................................................................ 454
14.7.2 Designing for Thermal Performance......................................................... 454
Thermal Attributes ........................................................................................... 455
14.8.1 Typical System Definitions ..................................................................... 455
82574 Package Thermal Characteristics .............................................................. 456
14.12.1Attaching the Thermocouple................................................................... 458
82574 GbE Controller—Datasheet